BD63860EFV-E2

Product Summary

The BD63860EFV-E2 is a high-grade stepping motor driver with an internal 3-bit DAC, designed to drive bipolar stepping motors in eighth-step modes. The IC features several integrated protection circuits and achieves excellent thermal dissipation performance due to its low ON-resistance DMOS output transistors and high-dissipation power package. This IC is rated for 36 V maximum input voltage / 2.5 A maximum output current and employs a constant-current, PWM allowing for full-, half-, quarter- and eighth-step excitation modes. The applications of the BD63860EFV-E2 include Laser printers, multi-function printers, inkjet printers, scanners, mini printers, PPCs, photo printers, etc.

Parametrics

BD63860EFV-E2 absolute maximum ratings: (1)Supply voltage, VCC1,2: -0.2 to 36.0 V; (2)Power dissipation, Pd: 1.45W; 4.7W; (3)Control pin input voltage, VIN: -0.2 to 7.0 V; (4)RNF maximum voltage, VRNF: 1.0 V; (5)Maximum output current, IOUT: 2.5A / phase; (6)Operating temperature range, Topr: -25 to 85℃; (7)Storage temperature range, Tstg: -55 to 150℃; (8)Junction temperature, Tjmax: 150℃.

Features

BD63860EFV-E2 features: (1)Single power supply input (Vin max. 36 V); (2)Rated output current: 2.5 A (peak); (3)Low ON-resistance DMOS output (0.8 Ω total across upper + lower FETs); (4)Serial/CLK-IN drive mode (integrated translator circuit); (5)PWM constant-current control (fixed chopping frequency); (6)Built-in spike noise cancel function (external noise filter is unnecessary); (7)Full-, half-, quarter- and eighth-step functionality; (8)AUTO decay mode; (9)Current decay mode switching function (linearly variable fast/slow decay ratio); (10)Normal rotation & reverse rotation switching function; (11)Power-save function; (12)Built-in logic input pull-down resistor; (13)Power-on reset function; (14)Thermal shutdown circuit (TSD); (15)Over-current protection circuit (OCP); (16)Under-voltage lockout circuit (UVLO); (17)Over-voltage lockout circuit (OVLO); (18)Ghost Supply Prevention (protects against malfunction when power supply is disconnected); (19)Micro-miniature, ultra-thin and high heat-radiation (exposed metal type) HTSSOP package.

Diagrams