(China (Mainland))
Product Summary
The EPF10K30RC208-3 is an industry first embedded PLD. Based on reconfigurable CMOS SRAM elements, the Flexible Logic Element MatriX (FLEX) architecture incorporates all features necessary to implement common gate array megafunctions. With up to 250,000 gates, the EPF10K30RC208-3 provides the density, speed, and features to integrate entire systems, including multiple 32-bit buses, into a single device.
Parametrics
EPF10K30RC208-3 absolute maximum ratings: (1)Supply voltage With respect to ground (2): –2.0 to 7.0 V; (2)DC input voltage: –2.0 to 7.0 V; (3)DC output current, per pin: –25 to 25 mA; (4)Storage temperature No bias: –65 to 150℃; (5)Ambient temperature Under bias: –65 to 135℃; (6)Junction temperature Ceramic packages, under bias: 150℃; PQFP, TQFP, RQFP, and BGA packages, under bias, 135℃.
Features
EPF10K30RC208-3 features: (1)The industry first embedded programmable logic device (PLD) family, providing System-on-a-Programmable-Chip (SOPC) integration; (2)High density; (3)System-level features; (4)Flexible interconnect; (5)Powerful I/O pins; (6)Peripheral register for fast setup and clock-to-output delay; (7)Flexible package options.
Diagrams
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 EPF10K30RC208-3 |
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IC FLEX 10K FPGA 30K 208-RQFP |
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EPF10K30RC208-3N |
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IC FLEX 10K FPGA 30K 208-RQFP |
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